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CINCH ModICE® SE & LE Enclosures

CINCH ModICE® SE & LE


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Check out the ModICE® ME for all the protection of the SE & LE enclosures in a more compact board size.













SE/LE CONTROL MODULE PROTECTION

The SE and LE sizes of CINCH’s Modular Integrated Connector Enclosures (ModICE®) line offer high quality sealed packaging solutions for electronic control module applications. The CINCH 1.5mm SHS System is the base interconnect technology for these enclosures. These enclosures are RoHS compliant, sealed to IP67 & IP69K and remain sealed even when the harness connectors are not mated. The ModICE® line is operable at temperatures ranging from -40°C to 85°C, and is resistant to most industrial fluids. Both the SE and LE are offered with integrated heat shrink.

Board Size
  • SE 4.50 x 4.60"
  • LE 6.00 x 6.10"
Standard Features
  • Interfaces with CINCH SHS Harness Connector
  • SE Headers 18, 30 and 48 I/O
  • LE Headers 30, 48 and 60 I/O
Optional Features
  • Headers with integrated ferrite filtering
  • Vented enclosures (Breather vent)
  • Enclosures with integrated heat sink
  • Additional custom modifications available from PEI-Genesis
Material Specification ModICE®
  • Housing - Glass filled polymer
  • Pins - Brass - Post tin plated
  • Seals - Silicone elastomer
  • RoHS - Compliant
 
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