TE Connectivity Microminiature HDSM Microdot Connectors
HIGH-DENSITY, LOW ENGAGEMENT FORCE CONNECTORS
TE Connectivity High-Density Standard Model (HDSM) Microdot connectors are designed for four-row .50 (1.27) pitch density with a low force twist pin that meets all requirements of MIL-DTL-55302 and MIL-DTL-83513. These high-density Microdot connectors comprise a complete contact system that is adaptable to a variety of form factors.
The HDSM Microdot connectors are designed for surface mounting on both the daughterboard and motherboard for increased circuit density. Their design is especially well-suited for harsh external conditions with a temperature range of -55° C to +125° C and the ability to withstand 500 mating cycles with no electrical or mechanical defects. With a highly reliable twist pin and socket, HDSM Microdot connectors meet the demands of various markets, including military, space, downhole offshore oil and gas, geophysical exploration, commercial satellites and commercial aerospace.